Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package

Aurore Quelennec (1, 2) , Umar Shafique (3, 2) , Eric Duchesne , Hélène Fremont (1) , Dominique A Drouin (4, 2, 3)

1 IMS - Laboratoire de l'intégration, du matériau au système
2 LN2 - Laboratoire Nanotechnologies Nanosystèmes
3 3IT - Institut Interdisciplinaire d'Innovation Technologique [Sherbrooke]
4 UdeS - Université de Sherbrooke

Domaines: Sciences de l'ingénieur [physics]; Micro et nanotechnologies/Microélectronique

Aurore Quelennec, Umar Shafique, Eric Duchesne, Hélène Fremont, Dominique A Drouin. Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package. 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), May 2017, Orlando, United States. IEEE, pp.513-519, 2017, ⟨10.1109/ECTC.2017.140⟩. ⟨hal-02074222⟩