Characterizing and modelling the behaviour of an isotropic conductive adhesive in view of electronic assembly fatigue life studies under thermal cycling

S. Pin (1) , M. Sartor (1) , L. Michel (1) , J. Parain (2) , S. Dareys (3)

1 INSA - Institut National des Sciences Appliquées
2 TAS - Thales Alenia Space [Toulouse]
3 CNES - Centre National d'Études Spatiales [Toulouse]

Domaines: Matériaux et structures en mécanique [physics.class-ph]

S. Pin, M. Sartor, L. Michel, J. Parain, S. Dareys. Characterizing and modelling the behaviour of an isotropic conductive adhesive in view of electronic assembly fatigue life studies under thermal cycling. 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2014, Belgium, France. pp.1-7, ⟨10.1109/EuroSimE.2014.6813820⟩. ⟨hal-02056739⟩