Characterizing and modelling the behaviour of an isotropic conductive adhesive in view of electronic assembly fatigue life studies under thermal cycling

Complete list of metadatas

https://hal.archives-ouvertes.fr/hal-02056739
Contributor : Marc Sartor <>
Submitted on : Monday, March 4, 2019 - 5:39:11 PM
Last modification on : Wednesday, March 6, 2019 - 1:26:03 AM

Identifiers

Collections

Citation

S. Pin, M. Sartor, L. Michel, J. Parain, S. Dareys. Characterizing and modelling the behaviour of an isotropic conductive adhesive in view of electronic assembly fatigue life studies under thermal cycling. 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2014, Belgium, France. pp.1-7, ⟨10.1109/EuroSimE.2014.6813820⟩. ⟨hal-02056739⟩

Share

Metrics

Record views

21