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Communication Dans Un Congrès Année : 2015

Effect of aluminum during the high temperature solution growth of Si-face 4H-SiC

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Matériaux
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hal-02016977 , version 1 (13-02-2019)

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  • HAL Id : hal-02016977 , version 1

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Didier Chaussende, L. Parent-Bert, Yj Shin, Thierry Ouisse, T. Yoshikawa. Effect of aluminum during the high temperature solution growth of Si-face 4H-SiC. 16th International Conference on Silicon Carbide and Related Materials, Oct 2015, Giardini Naxos, Italy. ⟨hal-02016977⟩
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