X-ray μ-Laue diffraction analysis of Cu through-silicon vias: A two-dimensional and three-dimensional study

Dario Ferreira Sanchez (1) , David Laloum (2) , Monica Larissa Djomeni Weleguela (2) , Olivier Ulrich , Guillaume Audoit , Adeline Grenier (2) , Jean-Sébastien Micha , Odile Robach (3) , Fréderic Lorut (4) , Patrice Gergaud (2) , Pierre Bleuet (5)

1 UGA [2016-2019] - Université Grenoble Alpes [2016-2019]
2 CEA-LETI - Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information
3 NRS - Nanostructures et Rayonnement Synchrotron
4 ST-CROLLES - STMicroelectronics [Crolles]
5 ESRF - European Synchrotron Radiation Facility

Domaines: Micro et nanotechnologies/Microélectronique

Dario Ferreira Sanchez, David Laloum, Monica Larissa Djomeni Weleguela, Olivier Ulrich, Guillaume Audoit, et al.. X-ray μ-Laue diffraction analysis of Cu through-silicon vias: A two-dimensional and three-dimensional study. Journal of Applied Physics, 2014, 116 (16), pp.163509. ⟨hal-02008119⟩