BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications

Mesut Inac (1) , Matthias Wietstruck (1) , Alexander Goritz (1) , Barbaros Cetindogan (1) , Canan Baristiran-Kaynak (1) , Steffen Marschmeyer (1) , Mirko Fraschke (1) , Thomas Voss (1) , Andreas Mai (1) , Cristiano Palego (2) , Arnaud Pothier (3) , Mehmet Kaynak (1)

1 IHP - Leibniz-Institut für innovative Mikroelektronik
2 Bangor University
3 XLIM-RFEI - RF-ELITE : RF-Electronique Imprimée pour les Télécommunications et l'Energie

Domaines: Sciences de l'ingénieur [physics]

Mesut Inac, Matthias Wietstruck, Alexander Goritz, Barbaros Cetindogan, Canan Baristiran-Kaynak, et al.. BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications. 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), May 2017, Orlando, United States. pp.786-791. ⟨hal-02006929⟩