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Article Dans Une Revue Micro and Nano Engineering Année : 2018

In situ monitoring of stress change in GeTe thin films during thermal annealing and crystallization

B. Ben Yahia
  • Fonction : Auteur
M.S. Amara
  • Fonction : Auteur
M. Gallard
  • Fonction : Auteur
C. Mocuta
R. Chahine
  • Fonction : Auteur
C. Sabbione
  • Fonction : Auteur
L. Fellouh
  • Fonction : Auteur

Résumé

Stress changes in GeTe thin films on silicon have been studied in situ as a function of temperature by optical curvature measurements. Crystallization of the initially amorphous layers is evidenced by a steep tensile stress buildup. The crystallization temperature is shown to be thickness-dependent for the thinner films. Various annealing conditions, such as cooling/re-heating steps and isothermal stages, allow exploring the thermo-mechanical behavior of the films. A non-thermoelastic temperature-dependent behavior is observed in the amorphous phase before crystallization.

Domaines

Matériaux

Dates et versions

hal-01951257 , version 1 (11-12-2018)

Identifiants

Citer

B. Ben Yahia, M.S. Amara, M. Gallard, N. Burle, S. Escoubas, et al.. In situ monitoring of stress change in GeTe thin films during thermal annealing and crystallization. Micro and Nano Engineering, 2018, ⟨10.1016/j.mne.2018.10.001⟩. ⟨hal-01951257⟩
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