Towards Reliable 10 mu m Pitch Assembly Using Cu/Ni/SnAg based Interconnects

Abstract : In this paper, the interconnect for 10 mu m are evaluated. Two processes for obtaining interconnects for 10 mu m pitch are compared in terms of reliability. One process yields the interconnects with Ni3Sn4 intermetallic (IMC) joint (interconnect A) while other yields the interconnects with solder joint (interconnect B). To select the best process for the assembly at 10gim pitch, high temperature storage tests are performed at 150 degrees C, 175 degrees C and 200 degrees C for 500hrs. The evolution of the metallurgy for both the interconnects is evaluated. The failure mechanism is determined by measuring the change in resistance. On the basis of mechanism, failure statistic is made. Finally, the obtained results are discussed.
Type de document :
Communication dans un congrès
2017 IEEE 19TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2017, 345 E 47TH ST, NEW YORK, NY 10017 USA, Unknown Region. IEEE, 2017, Electronics Packaging Technology Conference Proceedings
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https://hal.archives-ouvertes.fr/hal-01914018
Contributeur : Hugo Van Landeghem <>
Soumis le : mardi 6 novembre 2018 - 16:22:06
Dernière modification le : lundi 25 février 2019 - 16:34:22

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  • HAL Id : hal-01914018, version 1

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D. Taneja, M. Volpertl, L. Mendizabal, T. Chaira, D. Henry, et al.. Towards Reliable 10 mu m Pitch Assembly Using Cu/Ni/SnAg based Interconnects. 2017 IEEE 19TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2017, 345 E 47TH ST, NEW YORK, NY 10017 USA, Unknown Region. IEEE, 2017, Electronics Packaging Technology Conference Proceedings. 〈hal-01914018〉

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