Densification of Ni and TiAl by SPS: kinetics and microscopic mechanisms
Résumé
Densification by spark plasma sintering (SPS) of ductile (Ni) and brittle (TiAl) metallic materials have been studied to elucidate the mechanism of densification in the two cases. Isothermal densification experiments were carried out to determine the activation parameters in Ni. Transmission electron microscopy (TEM) observations of thin foils extracted by focused ion beam (FIB) in the contact regions between particles of TiAl and Ni powders are presented. Macroscopically, the most striking feature observed here is that the densification of Ni takes place in the wide temperature range of 0.2-1.0 Tm, whereas that of TiAl varies in 0.7-0.9 Tm, which is significantly narrower (Tm being the melting temperature of Ni and the peritectic temperature of TiAl). In Ni, the low activation energy (164 ± 30 kJ/mol), the high dislocation density in the inter-particle contact region, and the formation of recovery cells involving dislocation climb, indicate that the rate-controlling mechanism is probably self-diffusion in dislocations. In TiAl, high dislocation densities leading to reorganization into sub-boundaries point to dislocation climb mechanisms, which are kinetically controlled by volume diffusion. The difference in densification kinetics between Ni and TiAl is then accounted for in terms of the difference in their respective rate-controlling mechanisms operative during densification.
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