M. El-zein and K. Reifsnider, Evaluation of G IC of a DCB specimen using an anisotropic solution, Journal of Composites, Technology and Research, vol.10, issue.4, pp.151-155, 1988.

F. Fournel, L. Continni, C. Morales, D. Fonseca, J. Moriceau et al., Measurement of bonding energy in an anhydrous nitrogen atmosphere and its application to silicon direct bonding technology, Journal of Applied Physics, vol.111, issue.10, 2012.
DOI : 10.1149/1.3193533

F. Fournel, C. Martin-cocher, D. Radisson, V. Larrey, E. Beche et al., Water Stress Corrosion in Bonded Structures, ECS Journal of Solid State Science and Technology, vol.4, issue.5, pp.124-130, 2015.
DOI : 10.1149/2.0031505jss
URL : http://jss.ecsdl.org/content/4/5/P124.full.pdf

F. Rieutord, L. Capello, R. Beneyton, C. Morales, A. Charvet et al., Rough Surface Adhesion Mechanisms for Wafer Bonding, ECS Transactions, pp.205-215, 2006.
DOI : 10.1149/1.2357071

C. Sabbione, D. Cioccio, L. Vandroux, L. Nieto, J. Rieutord et al., Low temperature direct bonding mechanisms of tetraethyl orthosilicate based silicon oxide films deposited by plasma enhanced chemical vapor deposition, Journal of Applied Physics, vol.112, issue.6, 2012.
DOI : 10.1116/1.589070