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Communication Dans Un Congrès Année : 2018

PCB-Embedding of Power Dies Using Pressed Metal Foam

Enfouissement PCB de puces de puissance à l'aide d'un contact en mousse métallique pressée

Résumé

This paper presents a new technique to manufacture the top-side contact of a PCB-embedded power die, using a pressed piece of metal foam. The manufacturing process is detailed, prototypes are manufactured and electrically characterized, and the technique is used to embed a switching cell with a 1.7 nH switching loop. This process is easy to make and highly cost-effective; the electric resistance of the assembly is close to that of a state-of-the-art industrial package using bond wires, moreover the stray inductance is minimized.
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Dates et versions

hal-01811765 , version 1 (10-06-2018)

Identifiants

  • HAL Id : hal-01811765 , version 1

Citer

Yoann Pascal, Denis Labrousse, Mickael Petit, Stéphane Lefebvre, François Costa. PCB-Embedding of Power Dies Using Pressed Metal Foam. Power Conversion and Intelligent Motion (PCIM) Europe , Jun 2018, Nuremberg, Germany. ⟨hal-01811765⟩
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