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Article Dans Une Revue Microelectronic Engineering Année : 2013

Copper Electrodeposition into Macroporous Silicon Arrays for through Silicon via Applications

Résumé

The present paper deals with the formation of high conductivity through silicon via from macroporous silicon arrays. The through wafer macropores were first etched by anodization into a hydrofluoric acid – ethanol mixture. The conditions of straight and ordered macropore etching were studied. The high aspect ratio (18) and high density via (above 105/cm2) were then filled by copper using an optimized potentiostatic technique involving a specific electrolyte with additives. The copper micro-wires were observed by SEM whereas XRD analysis enabled the determination of the average grain size.

Dates et versions

hal-01810902 , version 1 (08-06-2018)

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Citer

Thomas Defforge, Loïc Coudron, Olivier Ménard, Virginie Grimal, Gaël Gautier, et al.. Copper Electrodeposition into Macroporous Silicon Arrays for through Silicon via Applications. Microelectronic Engineering, 2013, 106, pp.160-163. ⟨10.1016/j.mee.2013.01.014⟩. ⟨hal-01810902⟩
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