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Deep reactive ion etching of sub-micrometer trenches with ultra high aspect ratio

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https://hal.archives-ouvertes.fr/hal-01767970
Contributor : Philippe Basset Connect in order to contact the contributor
Submitted on : Monday, April 16, 2018 - 6:06:15 PM
Last modification on : Friday, August 5, 2022 - 2:54:00 PM

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Jayalakshmi Parasuraman, Anand Summanwar, Frédéric Marty, Philippe Basset, Dan Angelescu, et al.. Deep reactive ion etching of sub-micrometer trenches with ultra high aspect ratio. Microelectronic Engineering, Elsevier, 2014, 113, pp.35 - 39. ⟨10.1016/j.mee.2013.06.010⟩. ⟨hal-01767970⟩

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