Printing of microstructure strain sensor for structural health monitoring

Abstract : Recent advances in microelectronics and materials should allow the development of integrated sensors with transduction properties compatible with being printed directly onto a 3D substrate, especially metallic and polymer substrates. Inorganic and organic electronic materials in microstructured and nanostructured forms, intimately integrated in ink, offer particularly attractive characteristics, with realistic pathways to sophisticated embodiments. Here, we report on these strategies and demonstrate the potential of 3D-printed microelectronics based on a structural health monitoring (SHM) application for the precision weapon systems. We show that our printed sensors can be employed in non-invasive, high-fidelity and continuous strain monitoring of handguns, making it possible to implement printed sensors on a 3D substrate in either SHM or remote diagnostics. We propose routes to commercialization and novel device opportunities and highlight the remaining challenges for research. © 2017, Springer-Verlag Berlin Heidelberg.
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Submitted on : Wednesday, April 11, 2018 - 6:21:58 PM
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M.Q. Le, F. Ganet, D. Audigier, J.-F. Capsal, P.-J. Cottinet. Printing of microstructure strain sensor for structural health monitoring. Applied physics. A, Materials science & processing, Springer Verlag, 2017, 123 (5), 〈10.1007/s00339-017-0970-x〉. 〈hal-01764310〉



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