Innovative connectivity for double side cooling and connection of power dice in the context of automotive power mechatronic packaging for high power inverters
Résumé
Today, the automotive industry is facing important challenges drawn by fuel shortage and the need for more environment friendly vehicles. In this context, the hybrid vehicle market is now growing rapidly for small city cars without neglecting full-size cars. In parallel, all OEMs and tier-ones are developing programs about full electrical vehicles. These new developments are going together with the need for power electronics inverters and converters that are small in size with very high power density. It should not be forgotten that the affordability is the key technology driver for all these new developments. To achieve these targets, it is proposed a challenging power mechatronic technology that gives the capabilities for power semi-conductors double side connection and double sided cooling. The stylishness of this technology is that it uses standard power semi-conductors with standard metallization, the dice assembly being performed with standard manufacturing means with few material adaptations. This paper will discuss the latest results obtained from the research work to design and build such a power mechatronic module in a way that device current density can increase keeping junction temperatures at reasonable level. It will present a comprehensive analysis of the power cycling performances of a power switch build from this new power mechatronic package. The given power mechatronic switch is then used to demonstrate the performance a 60kVA DC/AC, which power is well suited for electrical vehicle applications.