Evaluation of Substrate Technologies under High Temperature Cycling

Laurent Dupont (1) , Stéphane Lefebvre (2) , Zoubir Khatir (1) , Serge Bontemps (3)

1 INRETS/LTN - Laboratoire des Technologies Nouvelles
2 SATIE - Systèmes et Applications des Technologies de l'Information et de l'Energie
3 APT Europe

This paper presents experimental results on the influence of different structures of ceramic substrates under very high temperature cycles. Test vehicles have been realised by APT Europe. Especially, DCB metallization thickness effects are pointed out in the ceramic fracture and solder delamination due to the high temperature variations. Special substrates, like DAB and Si3N4, are also investigated and compared to classical DCBs. Finally, the paper compares the different technologies under high temperature cycles, in order to identify the main factors that could increase the lifetime expectancy of power modules in such harsh environments.

Mots clés: CERAMIQUE; HAUTE TEMPERATURE; ELECTRONIQUE

Domaines: Electronique

Laurent Dupont, Stéphane Lefebvre, Zoubir Khatir, Serge Bontemps. Evaluation of Substrate Technologies under High Temperature Cycling. CIPS 2006 - 4th International Conference on Integrated Power Electronics Systems, Jun 2006, Naples, Italy. 6p. ⟨hal-01704198⟩