Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2007

Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

Résumé

The paper presents experimental investigations on both power and thermal cycling conditions on 600V-200A six-pack IGBT power modules. Both types of cycles are compared in term of thermomechanical stresses by using Finite Element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications. IGBT, High temperature electronics, Hybrid Power Integration, Power electronic modules, Packaging, Power cycling, Thermal cycling, Automotive Application.
Fichier non déposé

Dates et versions

hal-01702003 , version 1 (06-02-2018)

Identifiants

Citer

Mounira Bouarroudj, Zoubir Khatir, Jean Pierre Ousten, Laurent Dupont, Stéphane Lefebvre, et al.. Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules. EPE 2007 - 12th European Conference on Power Electronics and Applications, Sep 2007, Aalborg, Denmark. 10p, ⟨10.1109/EPE.2007.4417457⟩. ⟨hal-01702003⟩
63 Consultations
0 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More