When Reliability is Imperative, Ability to Quantify It is a Must, IMAPS Advanced Microelectronics, 2012. ,
Are Current Qualification Practices Adequate?, Circuit Assembly, 2011. ,
Considering Electronic Product's Quality Specifications by Application(s), Chip Scale Reviews, vol.16, issue.4, 2012. ,
Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests, Keynote address at the SPIE's 7-th Annual Int ,
Reliability and Accelerated Life Testing, Semiconductor International, 2005. ,
Availability Index and Minimized Reliability Cost, Circuit Assemblies, 2013. ,
Thermal Stress Modeling in Microelectronics and Photonics Packaging, and the Application of the Probabilistic Approach: Review and Extension, IMAPS International Journal of Microcircuits and Electronic Packaging, vol.23, issue.2, 2000. ,
Thermo-Mechanical Stress Modeling in Electronics and Photonics, Electronic Cooling, vol.7, issue.4, 2001. ,
Thermal Stress Failures: Predictive Modeling Explains the Reliability Physics Behind Them, IMAPS Advanced Microelectronics, vol.38, issue.4, 2011. ,
Predictive Modeling is a Powerful Means to Prevent Thermal Stress Failures in Electronics and Photonics, Chip Scale Reviews, vol.15, issue.4, 2011. ,
Thermal Stress Failures in Electronics and Photonics: Physics, Modeling, Prevention, Journal of Thermal Stresses, vol.13, issue.3, 2013. ,
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