E. Suhir, When Reliability is Imperative, Ability to Quantify It is a Must, IMAPS Advanced Microelectronics, 2012.

E. Suhir and R. Mahajan, Are Current Qualification Practices Adequate?, Circuit Assembly, 2011.

E. Suhir, Considering Electronic Product's Quality Specifications by Application(s), Chip Scale Reviews, vol.16, issue.4, 2012.

E. Suhir, Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests, Keynote address at the SPIE's 7-th Annual Int

E. Suhir, Reliability and Accelerated Life Testing, Semiconductor International, 2005.

E. Suhir and L. Bechou, Availability Index and Minimized Reliability Cost, Circuit Assemblies, 2013.

E. Suhir, Thermal Stress Modeling in Microelectronics and Photonics Packaging, and the Application of the Probabilistic Approach: Review and Extension, IMAPS International Journal of Microcircuits and Electronic Packaging, vol.23, issue.2, 2000.

E. Suhir, Thermo-Mechanical Stress Modeling in Electronics and Photonics, Electronic Cooling, vol.7, issue.4, 2001.

E. Suhir, Thermal Stress Failures: Predictive Modeling Explains the Reliability Physics Behind Them, IMAPS Advanced Microelectronics, vol.38, issue.4, 2011.

E. Suhir, Predictive Modeling is a Powerful Means to Prevent Thermal Stress Failures in Electronics and Photonics, Chip Scale Reviews, vol.15, issue.4, 2011.

E. Suhir, Thermal Stress Failures in Electronics and Photonics: Physics, Modeling, Prevention, Journal of Thermal Stresses, vol.13, issue.3, 2013.
DOI : 10.1016/j.yofte.2006.03.003

E. Suhir, Analytical Modeling in Structural Analysis for Electronic Packaging: Its Merits, Shortcomings and Interaction with Experimental and Numerical Techniques, ASME Journal of Electronic Packaging, vol.111, issue.2, 1989.

E. Suhir, Analytical Stress-Strain Modeling in Photonics Engineering: Its Role, Attributes and Interaction with the Finite-Element Method, Laser Focus World, 2002.

. Suhir, R. Mahajan, A. Lucero, L. Bechou, . Ieee-/-aiaa-aerospace-conf et al., Probabilistic Design for Reliability Probabilistic Design for Reliability (PDfR) and a Novel Approach to Qualification Testing (QT) Could Electronics Reliability Be Predicted Quantified and Assured? Microelectronics Reliability Six Sigma: The Breakthrough Management Strategy Revolutionizing the World's Top Corporations Highly Accelerated Life Testing (HALT), Failure Oriented Accelerated Testing (FOAT), and Their Role in Making a Viable Device into a Reliable Product Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making a Viable IC Package into a Reliable ProductQuantified Reliability of Aerospace Optoelectronics Analysis of a Pre-Stressed Bi-Material Accelerated Life Test (ALT) Specimen Analysis of a Bow-Free Pre- Stressed Test Specimen Kinetic Concept of the Strength of Solids Application of Multi- Parametric BAZ Model in Aerospace Optoelectronics Applied Probability for Engineers and Scientists, Analytical Thermal Stress Modeling in Electronic and Photonic Systems Predicted Reliabilty of Aerospace Electronics: Application of Two Advanced Probabilistic Concepts IEEE Aerospace Conference Zeitschrift fur Angewandte Mathematik und Mechanik (ZAMM) IEEE Aerospace Conference Boltzmann-Arrhenius- Zhurkov (BAZ) Model in Physics-of-Materials Problems) [29] Suhir, E, Bechou L., and Bensoussan, A., " Technical Diagnostics of Electronics Products: Application of Bayes Formula and Boltzmann-Arrhenius-Zhurkov Model Statistics-and Reliability-Physics-Related Failure Processes Modern Physics Letters B (MPLB), pp.2014-2014, 1965.

E. Suhir and B. Poborets, Solder Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability); see also, Proc. of the 40th Elect. Comp. and Techn. Conf, 1990.