E. Suhir, Stresses in Bi-Metal Thermostats, Journal of Applied Mechanics, vol.53, issue.3, 1986.
DOI : 10.1115/1.3171827

E. Suhir, Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies, Int. Symp. on Hybrid Microelectronics, ISHM, 1986.

E. Suhir, Die Attachment Design and Its Influence on Thermal Stresses in the Die and the Attachment, 37th Electron. Comp. and Techn.Conf. (ECTC), 1987.

E. Suhir, An Approximate Analysis of Stresses in Multilayer Elastic Thin Films, JAM, vol.55, issue.3, 1988.

E. Suhir, Interfacial Stresses in Bi-Metal Thermostats, JAM, vol.56, issue.3, 1989.
DOI : 10.1115/1.3176133

B. Kiang, J. Wittmershaus, R. Kar, and N. Sugai, Package warpage evaluation for multi-layer molded PQFP, [1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium, 1991.
DOI : 10.1109/IEMT.1991.279753

E. Suhir and L. T. Manzione, Predicted Bow of Plastic Packages Due to the Non-uniform Through-Thickness Distribution of Temperature, ASME J. Electr. Pack. (JEP), vol.114, issue.3, 1992.

E. Suhir, Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices, J. Reinf. Plastics and Comp, vol.12, 1993.

L. T. Nguyen, K. L. Chen, L. , and P. , Leadframe designs for minimum molding-induced warpage, 1994 Proceedings. 44th Electronic Components and Technology Conference, 1994.
DOI : 10.1109/ECTC.1994.367545

G. Kelly, C. Lyden, W. Lawton, J. Barrett, A. Saboui et al., Accurate Prediction of PQFP Warpage, p.44, 1994.

G. Kelly, C. Lyden, W. Lawton, J. Barrett, A. Saboui et al., The Importance of Molding Compound Chemical Shrinkage in the Stress and Warpage Analysis of PQFPs, 1995.

L. Yip and A. Hamzehdoost, Package warpage evaluation for high performance PQFP, 1995 Proceedings. 45th Electronic Components and Technology Conference, 1995.
DOI : 10.1109/ECTC.1995.514389

D. Liang, Warpage Study of Glob Top Cavity-UP EPBGA Packages, 1996.

K. Verma, D. Columbus, and B. Han, Development of real time/variable sensitivity warpage measurement technique and its application to plastic ball grid array package, IEEE Transactions on Electronics Packaging Manufacturing, vol.22, issue.1, 1999.
DOI : 10.1109/6104.755090

E. Suhir, Predicted Stresses in, and the Bow of, a Circular Substrate/Thin-Film System Subjected to the Change in Temperature, J. Appl. Physics (JAP), vol.88, issue.5, 2000.

S. Yang, S. Jiang, and L. , Ribbed Package Geometry for Reducing Thermal Warpage and Wire Sweep During PBGA Encapsulation, IEEE CPMT Transactions, vol.23, issue.4, 2000.

M. Ko, D. Shin, I. Lim, and Y. Park, Warpage Behavior of LOCTSOP Memory Package, Journal of Materials Science: Materials in Electronics, vol.12, issue.2, 2001.

D. Hai, R. E. Powell, C. R. Hanna, and I. C. Ume, Warpage Measurement Comparison Using Shadow Moiré and Projection Moiré Methods, IEEE CPMT Transactions, vol.25, issue.4, 2002.

M. Y. Tsai, C. H. Hsu, and C. N. Han, A Note on Suhir???s Solution of Thermal Stresses for a Die-Substrate Assembly, Journal of Electronic Packaging, vol.7, issue.1, 2004.
DOI : 10.1115/1.1648056

M. Y. Tsai, C. T. Wang, and C. H. Hsu, The Effect of Epoxy Molding Compound on Thermal/Residual Deformations and Stresses in IC Packages During Manufacturing Process, IEEE Transactions on Components and Packaging Technologies, vol.29, issue.3, 2006.
DOI : 10.1109/TCAPT.2006.880478

K. Irving, Y. Chien, J. Zhang, L. Rector, and M. Todd, Low Warpage Molding Compound Development for Array Packages, 1st Electronics System Integration Technology Conference (ESTC), 2006.

C. K. Lee, W. K. Loh, K. E. Ong, and I. Chin, Study of Dynamic Warpage of Flip Chip Packages under Temperature Reflow, 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium, 2006.
DOI : 10.1109/IEMT.2006.4456453

M. Y. Tsai, C. Y. Wu, C. Y. Huang, W. C. Cheng, Y. et al., Study of Some Parameter Effects on Warpage and Bump-Joint Stresses of COG Packages, IEEE Transactions on Advanced Packaging, vol.29, issue.3, 2006.
DOI : 10.1109/TADVP.2006.875094

M. Y. Tsai, C. Y. Huang, C. Y. Chiang, W. C. Chen, Y. et al., Experimental and Numerical Studies of Warpages of ACF-bonded COG Packages Induced from Manufacturing and Thermal Cycling, IEEE CPMT Transactions, vol.30, issue.4, 2007.

M. Y. Tsai, C. Y. Huang, C. Y. Chiang, W. C. Chen, Y. et al., Hygro-Thermal Warpages of COG Package with Non- Conductive Paste Adhesive, IEEE CPMT Transactions, vol.30, issue.3, 2007.

M. Y. Tsai, Y. C. Chen, S. W. Lee, and . Ricky, Correlation Between Measurement and Simulation of Thermal Warpage in PBGA with Consideration of Molding Compound Residual Strain, IEEE CPMT Transactions, vol.31, issue.3, 2008.

M. Y. Tsai, Y. C. Chen, L. , and S. W. Ricky, Correlation Between Measurement and Simulation of Thermal Warpage in PBGA with Consideration of Molding Compound Residual Strain, IEEE CPMT Transactions, vol.31, issue.3, 2008.

J. Standard, Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature, JEDEC SOLID STATE TECHNOLOGY ASSOCIATION, pp.22-112, 2005.

C. Y. Huang, T. D. Li, and M. Y. Tsai, Warpage Measurement and Design of BGA Package Under Thermal Loading, 2009.

M. Tsai, H. Y. Chang, and M. Pecht, Warpage Analysis of Flip-Chip PBGA Packages Subject to Thermal Loading, IEEE Transactions on Device and Materials Reliability, vol.9, issue.3, 2009.

P. S. Huang, Y. H. Lin, C. Y. Huang, M. Y. Tsai, T. C. Huang et al., Warpage and curvature determination of PCB with DIMM socket during reflow process by strain gage measurement, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, 2010.
DOI : 10.1109/IMPACT.2010.5699599

C. G. Song and S. Choa, Numerical Study of Warpage and Stress for the Ultra Thin Package, IMAPS), 2010.

M. Y. Tsai, C. Y. Chiang, Y. Huang, and Y. S. , Residual Strain Measurement of Thin-Layer Cured Adhesives and Their Effects on Warpage in Electronic Packaging, IEEE CPMT Transactions, vol.33, issue.1, 2010.

W. Lin and N. J. , A Novel Method for Strip Level Warpage Simulation of PoP Package During Assembly Processes, pp.60-2010

E. Suhir and J. Weld, Electronic Package with Reduced Bending Stress, 1997.

E. Suhir, Device and Method of Controlling the Bowing of a Soldered or Adhesively Bonded Assembly, 2001.

E. Suhir, Bow Free Adhesively Bonded Assemblies: Predicted Stresses, Electrotechnik & Informationtechnik, vol.120, issue.6, 2003.

E. Suhir, Adhesively Bonded Assemblies with Identical Nondeformable Adherends and Inhomogeneous Adhesive Layer: Predicted Thermal Stresses in the Adhesive, J. Reinforced Plastics and Composites, vol.17, issue.14, 1998.

E. Suhir, Adhesively Bonded Assemblies with Identical Nondeformable Adherends and Nonhomogeneous Adhesive Layer: Predicted Thermal Stresses in the Adhesive, Journal of Reinforced Plastics and Composites, vol.15, issue.18, 1999.
DOI : 10.1115/1.2787268

E. Suhir, Adhesively bonded assemblies with identical nondeformable adherends and ???piecewise continuous??? adhesive layer: predicted thermal stresses in the adhesive, International Journal of Solids and Structures, vol.37, issue.16, 2000.
DOI : 10.1016/S0020-7683(98)00317-5

E. Suhir, C. Gu, and L. Cao, Predicted Thermal Stress in a Circular Adhesively Bonded Assembly with Identical Adherends, ASME J. Appl. Mech, vol.79, issue.1, 2011.

E. Suhir, Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making a Viable IC Package into a Reliable Product, Circuits Assembly, 2013.

E. Suhir, A. Bensoussan, J. Nicolics, and L. Bechou, Highly Accelerated Life Testing (HALT), Failure Oriented Accelerated Testing (FOAT), and Their Role in Making a Viable Device into a Reliable Product, IEEE Aerospace Conference, 2014.

E. Suhir, Analysis of a pre-stressed bi-material accelerated-life-test (ALT) specimen, Zeitschrift fur Angewandte Mathematik und Mechanik (ZAMM), 2011.
DOI : 10.1109/TCAPT.2003.817654

E. Suhir and J. Nicolics, Analysis of a Bow-Free Pre-Stressed Test Specimen, ASME JAM, vol.81, issue.11, 2014.

E. Suhir, Analysis of a short beam with application to solder joints: could larger stand-off heights relieve stress?, The European Physical Journal Applied Physics, vol.41, issue.3
DOI : 10.1080/14786442108636264

E. Suhir, Structural Analysis of Microelectronic and Fiber Optic Systems, 1991.
DOI : 10.1007/978-94-011-6535-8