Creep behavior of submicron copper films under irradiation

P. Lapouge , F. Onimus (1) , M. Coulombier (2) , J.-P. Raskin (3) , T. Pardoen (4) , Y. Brechet (5)

1 CEA-DES (ex-DEN) - CEA-Direction des Energies (ex-Direction de l'Energie Nucléaire)
2 UCL - Université Catholique de Louvain = Catholic University of Louvain
3 Microwave Lab
4 CeRMiN, Research Center in Micro and Nanoscopic Materials and Electronic Devices
5 SIMaP - Science et Ingénierie des Matériaux et Procédés

Domaines: Matériaux

P. Lapouge, F. Onimus, M. Coulombier, J.-P. Raskin, T. Pardoen, et al.. Creep behavior of submicron copper films under irradiation. Acta Materialia, 2017, 131, pp.77 - 87. ⟨10.1016/j.actamat.2017.03.056⟩. ⟨hal-01685222⟩