Power cycling aging tests at 200°C of SiC assemblies for high temperature electronics

Résumé : The reliability of power electronic modules is of utmost importance all the more so since they would be exposed to high ambient temperatures and frequent power cycling. Aging tests at 200°C have been done using power cycling in order to study some packaging materials for high temperature power electronics. Junction temperature swings were performed between 196°C and 245°C and tests have concerned the die attach, wire bond and die metallization materials. Experimental results have shown that AuGe solder material is highly resistant comparatively to a high leaded material. Furthermore, for die top-metal/wire couple, gold material exhibits a better performance compared to Aluminum.
Type de document :
Communication dans un congrès
EPE 13 - European Conference on Power Electronics and Applications, Sep 2013, Lille, France. EPE 13 - European Conference on Power Electronics and Applications, 10p, 2013
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https://hal.archives-ouvertes.fr/hal-01671569
Contributeur : Ifsttar Cadic <>
Soumis le : vendredi 22 décembre 2017 - 13:57:05
Dernière modification le : mercredi 14 mars 2018 - 10:29:43

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  • HAL Id : hal-01671569, version 1

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Ali Ibrahim, Zoubir Khatir. Power cycling aging tests at 200°C of SiC assemblies for high temperature electronics. EPE 13 - European Conference on Power Electronics and Applications, Sep 2013, Lille, France. EPE 13 - European Conference on Power Electronics and Applications, 10p, 2013. 〈hal-01671569〉

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