Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package

Aurore Quelennec (1, 2) , Umar Shafique (2) , Éric Duchesne , Hélène Frémont (1) , Dominique Drouin (2)

1 IMS - Laboratoire de l'intégration, du matériau au système
2 3IT - Institut Interdisciplinaire d'Innovation Technologique [Sherbrooke]

Domaines: Micro et nanotechnologies/Microélectronique

Aurore Quelennec, Umar Shafique, Éric Duchesne, Hélène Frémont, Dominique Drouin. Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package. Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, 2017, Orlando, United States. ⟨hal-01660889⟩