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Comparative FEM thermo-mechanical simulations for built-in reliability: surface mounted technology versus embedded technology for silicon dies

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https://hal.archives-ouvertes.fr/hal-01593354
Contributor : Isabelle Bord <>
Submitted on : Tuesday, September 26, 2017 - 10:25:18 AM
Last modification on : Thursday, January 11, 2018 - 6:21:09 AM

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  • HAL Id : hal-01593354, version 1

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Mickaël Balmont, Isabelle Bord Majek, Yves Ousten. Comparative FEM thermo-mechanical simulations for built-in reliability: surface mounted technology versus embedded technology for silicon dies. 21st European Microelectronics ans Packaging Conference (EMPC 2017), Sep 2017, Warsaw, Poland. pp.150. ⟨hal-01593354⟩

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