High temperature ageing of microelectronics assemblies with SAC solder joints

Wissam Sabbah (1) , Pierre Bondue (2) , Oriol Aviño Salvado (1) , Cyril Buttay (1) , Héìène Frémont (2) , Alexandrine Guédon-Gracia (2) , Hervé Morel (1)

1 EE - Ampère, Département Energie Electrique
2 IMS - Laboratoire de l'intégration, du matériau au système

In some applications, electronic systems are expected to operate at high ambient temperature (e.g. 150 °C). In this paper, we investigate the failure mechanism and microstructure evolution of solder-free (SAC) solder joints at a maximum temperature of 175 °C. It is found that no new failure mechanisms are triggered, and that ageing tests for solder can be accelerated at 175 °C. In particular, the growth rate of the interfacial intermetallic compound (IMC) is found to be consistent with that observed at lower temperatures.

Domaines: Micro et nanotechnologies/Microélectronique

Wissam Sabbah, Pierre Bondue, Oriol Aviño Salvado, Cyril Buttay, Héìène Frémont, et al.. High temperature ageing of microelectronics assemblies with SAC solder joints. Microelectronics Reliability, 2017, ⟨10.1016/j.microrel.2017.06.065⟩. ⟨hal-01564755⟩