High sensitivity and high resolution differential interferometer: Micrometric polariscope for thermomechanical studies in microelectronics
Résumé
A high sensitivity and high resolution laser probe devoted to the thermomechanical studies of microelectronic interconnects has been developed. Surface displacements as low as 0.1 picometer (10−13m) can be observed, this allows the laser probe to investigate the edge effect in interconnects. The stress field induced by the edge forces in the underlying silicon dioxide layers has been observed. All measurements are performed with a micrometric lateral resolution.