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Temperature effect on the strength of a spray deposited Si-Al alloy for space application (abstract)

Abstract : New materials were recently developed to satisfy the rising requirements of thermal dissipation, densification and weight decrease of on-board electronic devices intended to satellites. These new materials are promising candidate materials to manufacture boxes for computing chips. This paper deals with a study about the Si-Al CE9F designed by Sandvik Osprey™, an alloy containing 60 wt% of silicon. This material is characterized by a low coefficient of thermal expansion (9e-6 K-1), a high thermal conductivity (130 W.m-1.K-1) and a low density (2.46) that makes this material attractive for space applications, specially optical housing, chips packaging, sensors carriers, lens holders for laser systems and also to solve SWaP (size, weight and power) issues. This study is focused on the mechanical properties of Si-Al alloy in the -50°C to 130°C temperature representative of the space applications.
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  • HAL Id : hal-01466783, version 1

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Damien Mauduit, Gilles Dusserre, Thierry Cutard. Temperature effect on the strength of a spray deposited Si-Al alloy for space application (abstract). International Conference on Composites and Nano Engineering, Jul 2015, Chengdu, China. ⟨hal-01466783⟩

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