Trends of power semiconductor wafer level packaging, Microelectronics Reliability, vol.50, issue.4, pp.514-521, 2010. ,
DOI : 10.1016/j.microrel.2009.09.002
An advanced approach to power module packaging, IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426), pp.8-11, 2000. ,
DOI : 10.1109/IWIPP.2000.885167
Integrated Flip-Chip Flex-Circuit Packaging for Power Electronics Applications, IEEE Transactions on Power Electronics, vol.19, issue.2, pp.515-522, 2004. ,
DOI : 10.1109/TPEL.2003.820586
Electric Characteristics of Planar Interconnect Technologies for Power MOSFETs, 2007 IEEE Power Electronics Specialists Conference, pp.1036-1042, 2007. ,
DOI : 10.1109/PESC.2007.4342134
SKiN: Double side sintering technology for new packages, 2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs, pp.324-327, 2011. ,
DOI : 10.1109/ISPSD.2011.5890856
Toward the Next Level of PCB Usage in Power Electronic Converters, IEEE Transactions on, vol.23, issue.6, pp.3151-3163, 2008. ,
PCB Integration Technology Overview, ECPE Seminar " Power PCBs and Busbars, 2008. ,
A novel high-temperature planar package for SiC multichip phase-leg power module, IEEE Transactions on, vol.25, issue.8, pp.2059-2067, 2010. ,
Planar Interconnect Technology for Power Module System Integration, Integrated Power Electronics Systems (CIPS), 2012 7 th International Conference on, pp.1-5, 2012. ,
Ultra Low Inductance Package for SiC, ECPE workshop on power boards, p.2012 ,
Power modules with embedded components, Microelectronics Packaging Conference (EMPC) , 2013 European, pp.1-4, 2013. ,