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EDT for Power Devices

Abstract : This presentation gives an overview of the packaging requirements for power electronics, especially in terms of thermal aspects. Then, it briefly describes the state-of-the-art in the topic of advanced Printed-Circuit-Board (PCB) use in power electronics. Finally, the embedding technology developed in the 3DPHI platform is presented
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Contributor : Cyril Buttay <>
Submitted on : Wednesday, September 28, 2016 - 10:24:29 AM
Last modification on : Monday, September 20, 2021 - 4:49:15 PM


  • HAL Id : hal-01373062, version 1


Cyril Buttay, Chenjiang Yu, Eric Labouré, Vincent Bley, Céline Combettes. EDT for Power Devices. Embedded Device Technology: “Disappearing Die – Embed your Chips”, IMAPS - NMI, Sep 2016, Caldicot, United Kingdom. ⟨hal-01373062⟩



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