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Conference papers

Harnessing fabrication process signature for predicting yield across designs

Ai Ahmadi 1 Haralampos-G. Stratigopoulos 2 Amit Nahar 3 Bob Orr 3 Michael Pas 3 yiorgos Makris 1 
1 UT Dallas - University of Texas at Dallas [Richardson]
2 CIAN - Circuits Intégrés Numériques et Analogiques
LIP6 - Laboratoire d'Informatique de Paris 6
3 Texas Instruments Inc.
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Conference papers
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https://hal.sorbonne-universite.fr/hal-01359613
Contributor : Haralampos Stratigopoulos Connect in order to contact the contributor
Submitted on : Friday, September 2, 2016 - 5:33:18 PM
Last modification on : Sunday, June 26, 2022 - 10:01:01 AM

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UPMC | CNRS | LIP6 | TDS-MACS | LIP6-CIAN | SORBONNE-UNIVERSITE | SU-SCIENCES

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Ai Ahmadi, Haralampos-G. Stratigopoulos, Amit Nahar, Bob Orr, Michael Pas, et al.. Harnessing fabrication process signature for predicting yield across designs. IEEE International Symposium on Circuits and Systems, May 2016, Montreal, Canada. ⟨10.1109/ISCAS.2016.7527386⟩. ⟨hal-01359613⟩

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