Broadband Dielectric-to-Half-Mode Air-Filled Substrate Integrated Waveguide Transition

Isaac Silva Sousa Lima (1) , Frédéric Parment (1) , Anthony Ghiotto (2) , Tan-Phu Vuong (1) , Ke Wu (3)

1 IMEP-LAHC - Institut de Microélectronique, Electromagnétisme et Photonique - Laboratoire d'Hyperfréquences et Caractérisation
2 IMS - Laboratoire de l'intégration, du matériau au système
3 Poly-Grames

This letter reports a broadband transition from dielectric-filled substrate integrated waveguide (DFSIW) to half mode air-filled substrate integrated waveguide (HM-AFSIW). The HM-AFSIW, demonstrated for the first time, is based on a multilayer printed circuit board (PCB) topology. Its fabrication involves three layers. The top and bottom substrates can make use of a low-cost standard substrate such as FR4. For our demonstration purpose, a back-to-back transition implementing a 10-mm-long HM-AFSIW operating over the entire Ka-band is fabricated. It achieves measured return loss of better than -15.9 dB and insertion loss of 0.79±0.25 dB (0.3±0.15 dB for the transition) from 26 to 40 GHz. This transition is of interest for interconnecting dielectric-loss-free components based on HM-AFSIW including, for example, leaky wave antennas.

Mots clés: Air-Filled SIW; HMSIW; SIW Substrate Integrated Waveguide

Domaines: Electromagnétisme

Isaac Silva Sousa Lima, Frédéric Parment, Anthony Ghiotto, Tan-Phu Vuong, Ke Wu. Broadband Dielectric-to-Half-Mode Air-Filled Substrate Integrated Waveguide Transition. IEEE Antennas and Wireless Propagation Letters, 2016, 26 (6), pp.383 - 385. ⟨10.1109/LMWC.2016.2555943⟩. ⟨hal-01345691⟩