Cooled Printed Circuit with multi-layer structure and low dielectric losses

Sébastien Bonnet (1, 2) , Serge Verdeyme (1, 2) , Michel Campovecchio (1, 2) , A. Dravet (3) , Marc-Yves Lienhart (3)

1 XLIM-SRF - Systèmes RF
2 XLIM - XLIM
3 THALES Airborne Systems [Elancourt]

The invention relates to the field of printed boards, and more specifically a printed circuit with a multi-layer structure. According to the invention, the printed circuit with a multi-layer structure comprises: - a first layer machined to form a spotface passing through the layer, - a second layer comprising a first cavity passing through the layer, - a third layer comprising, on one face, an electronic component such that it is in the first cavity, - a fourth layer comprising a second cavity, - a heat conducting element with two parts: one made from metal called a thermal cover, inserted into the spotface of the first layer so as to mechanically and electrically close the first cavity, the other made from a dielectric material with heat conduction >30W/(m.K), placed in the first cavity so as to be in contact with the electronic component.

Domaines: Electronique

Sébastien Bonnet, Serge Verdeyme, Michel Campovecchio, A. Dravet, Marc-Yves Lienhart. Cooled Printed Circuit with multi-layer structure and low dielectric losses. United States, Patent n° : US9609740 B2. 2017. ⟨hal-01287762⟩