From 3D thermal simulation of HBT devices to their thermal model integration into circuit simulators via Ritz vectors reduction technique - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2002

From 3D thermal simulation of HBT devices to their thermal model integration into circuit simulators via Ritz vectors reduction technique

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Electronique
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Dates et versions

hal-01279264 , version 1 (25-02-2016)

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  • HAL Id : hal-01279264 , version 1

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Raphaël Sommet, David Lopez, Raymond Quéré. From 3D thermal simulation of HBT devices to their thermal model integration into circuit simulators via Ritz vectors reduction technique. Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on, 2002, San Diego, United States. pp.22--28. ⟨hal-01279264⟩

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