EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package

Abstract : In this paper, the signal integrity (SI) and Electromagnetic Compatibility (EMC) performance of System-On-Chip (SoC) and stacked memory using Package-On-Package (PoP) technology is investigated. The reconfiguration of the IC-EMC software platform to PoP is described. From an existing 2D assembly using a discrete 65-nm SoC product, the benefits of PoP integration using a next-generation 28-nm product with stacked memory are analyzed, based on simulation and predictive analysis performed using IC-EMC software platform.
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Communication dans un congrès
10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2015), Nov 2015, Edimburgh, United Kingdom. Proceedings of EMC Compo 2015, 6p., 2015
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Contributeur : Alexandre Boyer <>
Soumis le : vendredi 6 novembre 2015 - 11:05:46
Dernière modification le : mercredi 28 février 2018 - 10:23:14
Document(s) archivé(s) le : lundi 8 février 2016 - 12:53:25

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  • HAL Id : hal-01225364, version 1

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Etienne Sicard, Alexandre Boyer, Priscillia Fernandez-Lopez, An Zhou, Nicolas Marier, et al.. EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package. 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2015), Nov 2015, Edimburgh, United Kingdom. Proceedings of EMC Compo 2015, 6p., 2015. 〈hal-01225364〉

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