Skip to Main content Skip to Navigation
Conference papers

Creep behavior of cold-curing epoxy adhesives: analysis and predictive approach

Résumé : Creep behavior of cold-curing epoxy adhesives: analysis and predictive approach This study investigates the creep behavior of two commercially available cold-curing epoxy adhesives, intended for the bonding of external composite reinforcements on concrete structures. In a preliminary stage, the characteristics of the mineral fillers (nature, content and size) contained in the two systems were determined, and the viscoelastic properties of the unfilled epoxy matrices extracted from these systems were analyzed. Short-term tensile creep experiments were then carried-out on cured samples of the two adhesives and their unfilled matrices, in order to evaluate the influence of the fillers and the polymer network characteristics on the instantaneous and delayed mechanical responses. Finally, two predictive approaches based on either the Time-Temperature Superposition Principle (TTSP) or the Time-Stress Superposition Principle (TSSP) were applied to evaluate the long-term creep behavior, and their suitability in the case of cold-curing adhesives was discussed.
Document type :
Conference papers
Complete list of metadata

https://hal.archives-ouvertes.fr/hal-01207683
Contributor : Ifsttar Cadic Connect in order to contact the contributor
Submitted on : Thursday, October 1, 2015 - 10:46:19 AM
Last modification on : Saturday, January 15, 2022 - 3:51:58 AM
Long-term archiving on: : Saturday, January 2, 2016 - 10:55:41 AM

File

doc00021783.pdf
Files produced by the author(s)

Identifiers

  • HAL Id : hal-01207683, version 1

Collections

Citation

Karim Benzarti, Nourredine Houhou, Marc Quiertant, Sylvain Chataigner. Creep behavior of cold-curing epoxy adhesives: analysis and predictive approach. Composites In Civil Engineering (CICE), Aug 2014, VANCOUVER, Canada. 7p. ⟨hal-01207683⟩

Share

Metrics

Les métriques sont temporairement indisponibles