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Silver sintering for power electronics integration

Abstract : Silver sintering is an attractive alternative to soldering in power electronics, as it offers higher electrical and thermal performance. Furthermore, sintered attaches can operate at a higher temperature. In this paper, we investigate the use of silver sintering for the bonding of passive components, and for the manufacturing of so-called 3D-modules. It is shown that this technique is well suited, as it makes it possible to operate at very high temperature (up to 310 °C demonstrated), and as it simplifies the assembly process (several identical sintering steps can be performed successively without problem).
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https://hal.archives-ouvertes.fr/hal-01196525
Contributor : Cyril Buttay <>
Submitted on : Thursday, September 10, 2015 - 6:26:28 AM
Last modification on : Monday, September 13, 2021 - 2:44:04 PM
Long-term archiving on: : Monday, December 28, 2015 - 11:33:10 PM

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Cyril Buttay, Bruno Allard, Raphaël Riva. Silver sintering for power electronics integration. ICEP- IAAC, IMAPS, Apr 2015, Kyoto, Japan. ⟨10.1109/ICEP-IAAC.2015.7111076⟩. ⟨hal-01196525⟩

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