Ultrashort pulse laser cutting of glass by controlled fracture propagation

K Mishchik (1) , C Javaux (2) , O Dematteo-Caulier (1) , Stefan Skupin (1) , B Chimier (1) , G Duchateau (1) , A Bourgeade (3) , R Kling (2) , C Hönninger (4) , J Lopez (1)

1 CELIA - Centre d'Etudes Lasers Intenses et Applications
2 alphanov
3 CESTA - Centre d'études scientifiques et techniques d'Aquitaine
4 Amplitude Systèmes

Laser induced controlled fracture propagation has great potential in cutting brittle materials such as glass or sapphire. In this paper we demonstrate that the use of ultrashort pulse laser sources may be advantageous since it allows to overcome several restrictions of the convenient method.

Domaines: Optique [physics.optics]; Physique Atomique [physics.atom-ph]; Physique des plasmas [physics.plasm-ph]

K Mishchik, C Javaux, O Dematteo-Caulier, Stefan Skupin, B Chimier, et al.. Ultrashort pulse laser cutting of glass by controlled fracture propagation. The 7th International Congress on Laser Advanced Materials Processing, May 2015, Kitakyushu, Japan. ⟨hal-01182098⟩