Cryoetching of Silicon and Advanced Materials for 3D Interconnects

Remi Dussart (1) , Thomas Tillocher (1) , Nicolas Gosset (1) , Philippe Lefaucheux (1) , Mohamed Boufnichel (2) , Rami Ljazouli (1) , Jean-Francois de Marneffe (3) , Mikhail Baklanov (3) , Koichi Yatsuda (4) , Kaoru Maekawa (4)

1 GREMI - Groupe de recherches sur l'énergétique des milieux ionisés
2 ST-CROLLES - STMicroelectronics [Crolles]
3 IMEC - IMEC
4 TEL - Tokyo Electron

Domaines: Physique des plasmas [physics.plasm-ph]

Remi Dussart, Thomas Tillocher, Nicolas Gosset, Philippe Lefaucheux, Mohamed Boufnichel, et al.. Cryoetching of Silicon and Advanced Materials for 3D Interconnects. 226th meeting of the Electroschemical Society, Oct 2014, Cancun, Mexico. ⟨hal-01151844⟩