Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy

Hugo Durou (1) , David Pech (2) , David Colin (3) , Patrice Simon (4) , Pierre-Louis Taberna (4) , Magali Brunet (2)

1 LAAS-N2IS - Équipe Nano Ingénierie et Intégration des Systèmes
2 LAAS-ISGE - Équipe Intégration de Systèmes de Gestion de l'Énergie
3 LAAS-TEAM - Service Techniques et Équipements Appliqués à la Microélectronique
4 CIRIMAT - Centre interuniversitaire de recherche et d'ingenierie des matériaux

In this paper a wafer-level process is proposed to fully integrate carbon-based micro-supercapacitor onto silicon substrate. This process relies on the deposition of a paste containing carbon, PVDF and acetone into cavities etched in silicon. After electrolyte deposition in a controlled atmosphere, a wafer-level encapsulation is realized. Cyclic voltammetry performed on non-encapsulated microcomponents showed specific energy of 257 mJ cm-2 for 336 lm deep cavities. The specific encapsulation process developed was tested separately and proved to be efficient in terms of resistance to organic electrolytes and mechanical strength.

Mots clés: Wafer-level; Micro-supercapacitors

Domaines: Matériaux; Matériaux

Hugo Durou, David Pech, David Colin, Patrice Simon, Pierre-Louis Taberna, et al.. Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy. Microsystem Technologies, 2012, vol. 18 (n° 4), pp. 467-473. ⟨10.1007/s00542-011-1415-7⟩. ⟨hal-01151753⟩