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Communication Dans Un Congrès Année : 2014

SIW Q-band filters using advanced multilayer PCB technology

S. Cadiou
  • Fonction : Auteur
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Cédric Quendo
E. Schlaffer
  • Fonction : Auteur
W Pessl
  • Fonction : Auteur
A. Le Fevre
  • Fonction : Auteur
M. Brizoux
  • Fonction : Auteur
D Baudet
  • Fonction : Auteur

Résumé

This paper deals with the design of Q-band filters using a low-cost multilayered Printed Circuit Board (PCB) substrate. In order to meet strong electrical specifications, the Substrate Integrated Waveguide (SIW) technique has been used to take profit of the complete build-up of the multilayered PCB. Advanced fabrication techniques of vias and micro-vias have also been developed in this project to implement 4th and 6th-order filters in this technology. The challenge here is to use a standard PCB process to design complex microwave devices that usually require accurate fabrication process and very low tolerances, especially in such frequency ranges. Based on that, two 2.8x8mm² prototypes have been designed, simulated and fabricated on a 1mm-thick PCB made of copper and blend of high performance resin material. Regarding the results of these filters, measured insertion & return losses are in a very good agreement with the simulation while exhibiting high rejections and low footprint.
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Dates et versions

hal-01132474 , version 1 (17-03-2015)

Identifiants

  • HAL Id : hal-01132474 , version 1

Citer

S. Cadiou, Cédric Quendo, E. Schlaffer, W Pessl, A. Le Fevre, et al.. SIW Q-band filters using advanced multilayer PCB technology. 44th European Microwave Conference, Oct 2014, Rome, Italy. ⟨hal-01132474⟩
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