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Telephone cord buckles—A relation between wavelength and adhesion
Abstract : Thin films with low adhesion and large residual stresses may buckle. The resulting morphologies are varied, but one of the most commonly observed is an intriguing oscillating pattern – the so-called "telephone cord" – which has been extensively investigated in the recent years. We have studied the kinematics of formation of telephone cords using a geometrically non-linear plate model and mode dependent interfacial toughness, captured via a cohe-sive zone. Through extensive Finite Element Simulations, we have demon-strated a simple, non trivial relation between telephone cord wavelength and interfacial toughness. To validate this prediction, highly stressed Mo thin films where deposited on Si wafers, with a well defined interface and very reproducible adhesion. Studying the morphology of the resulting buckles for different film thicknesses and stresses, we observed a trend which was fully consistent with our simulation results. From the data fit, an adhesion energy of 0.58 ± 0.04 Jm −2 for the SiO 2 /Ag interface was inferred, which compares well with literature estimates.
Cited literature [27 references]
https://hal.archives-ouvertes.fr/hal-01099837
Contributor : Valérie Tinchon Connect in order to contact the contributor
Submitted on : Monday, January 5, 2015 - 2:27:05 PM
Last modification on : Thursday, December 9, 2021 - 2:38:01 PM
Long-term archiving on: : Wednesday, June 3, 2015 - 4:40:15 PM
Contributor : Valérie Tinchon Connect in order to contact the contributor
Submitted on : Monday, January 5, 2015 - 2:27:05 PM
Last modification on : Thursday, December 9, 2021 - 2:38:01 PM
Long-term archiving on: : Wednesday, June 3, 2015 - 4:40:15 PM
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