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Article Dans Une Revue IEEE Transactions on Microwave Theory and Techniques Année : 2015

Substrate Integrated Waveguide Directional Couplers for Compact Three-Dimensional Integrated Circuits

Ali Doghri
Tarek Djerafi
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Ke Wu
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Résumé

A class of directional couplers based on substrate integrated waveguide (SIW) technique for compact three-dimensional (3-D) integrated circuits is proposed and studied in this work. Backward and forward couplers as well as strong coupling-defined forward couplers are presented and developed. They are composed of two joined SIW sections such that the common wall between them is made of a portion of the broad side of the first SIW and the narrow side of the second SIW. This perpendicular topology is arranged and formed through the use of a LEGO-like interconnect between the two SIW structures. Different coupling geometries developed with a low cost printed circuit board (PCB) process are studied. Design considerations and measured results at Ka-band are presented and discussed. To achieve respectively weak backward and forward directional couplings, Schwinger and Multihole-type directional couplers are introduced first of all, which make use of coupling slots arranged around the center of the SIW broad wall. For each of those structures, a wideband 20 dB directional coupler is fabricated and measured for demonstration purpose. To achieve a strong coupling, a Riblet-type directional coupler is proposed and examined. Subsequently, a 3 dB coupler is demonstrated together with a 0 dB coupler, offering a wideband and very efficient transition between the perpendicularly arranged SIWs. The proposed directional couplers can be used at millimeter-wave frequencies for probing and the design of compact 3-D integrated circuits and systems such as polarimetric imaging radiometer or antenna array feeding networks.
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Dates et versions

hal-01098489 , version 1 (25-12-2014)

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Ali Doghri, Tarek Djerafi, Anthony Ghiotto, Ke Wu. Substrate Integrated Waveguide Directional Couplers for Compact Three-Dimensional Integrated Circuits. IEEE Transactions on Microwave Theory and Techniques, 2015, 63 (1), pp.209-221. ⟨10.1109/TMTT.2014.2376560⟩. ⟨hal-01098489⟩
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