Impact of die-to-die and withindie parameter fluctuations on the maximum clock frequency distribution for gigascale integration Solid-State Circuits, IEEE Journal, vol.37, pp.183-190, 2002. ,
Thermal coupling in integrated circuits: application to thermal testing Solid- State Circuits, IEEE Journal, vol.36, pp.81-91, 2001. ,
Thermal signature, Proceedings of the 48th Design Automation Conference on, DAC '11, pp.108-113, 2011. ,
DOI : 10.1145/2024724.2024748
Globally Asynchronous, Locally Synchronous Circuits: Overview and Outlook, IEEE Design & Test of Computers, vol.24, issue.5, pp.430-441, 2007. ,
DOI : 10.1109/MDT.2007.164
An innovative local adaptive voltage scaling architecture for on-chip variability compensation, 2011 IEEE 9th International New Circuits and systems conference, pp.510-513, 2011. ,
DOI : 10.1109/NEWCAS.2011.5981331
On-chip voltage noise monitor for measuring voltage bounce in power supply lines using a digital tester, ICMTS 2000. Proceedings of the 2000 International Conference on Microelectronic Test Structures (Cat. No.00CH37095), pp.112-117, 2000. ,
DOI : 10.1109/ICMTS.2000.844416
A time-to-digitalconverter-based CMOS smart temperature sensor Solid-State Circuits, IEEE Journal, vol.40, pp.1642-1648, 2005. ,
Embedding Statistical Tests for on-chip Dynamic Voltage and Temperature Monitoring, Design Automation Conference (DAC), 2012 49th ACM, pp.994-999, 2012. ,
URL : https://hal.archives-ouvertes.fr/lirmm-00762020
Handbook of Parametric and Nonparametric Statistical Procedures, 2003. ,
DOI : 10.1201/9781420036268
Platform 2012, a many-core computing accelerator for embedded SoCs, Proceedings of the 49th Annual Design Automation Conference on, DAC '12, pp.1137-1142, 2012. ,
DOI : 10.1145/2228360.2228568
Dynamic Surface Temperature Measurements in ICs, Proceedings of the IEEE, vol.94, issue.8, pp.1519-1533, 2006. ,
DOI : 10.1109/JPROC.2006.879793
On-die droop detector for analog sensing of power supply noise Solid-State Circuits, IEEE Journal, vol.39, pp.651-660, 2004. ,