Thermomechanical stress analysis of copper/silicon interface in Through Silicon Vias using FEM simulations and experimental analysis

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Conference papers
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https://hal.archives-ouvertes.fr/hal-01067621
Contributor : Isabelle Bord <>
Submitted on : Tuesday, September 23, 2014 - 4:53:09 PM
Last modification on : Monday, February 25, 2019 - 4:34:19 PM

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  • HAL Id : hal-01067621, version 1

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Z. Remili, Y. Ousten, B. Levrier, D. Mercier, E. Suhir, et al.. Thermomechanical stress analysis of copper/silicon interface in Through Silicon Vias using FEM simulations and experimental analysis. ESTC 2014 5th Electronics System-Integration Technology Conference, Sep 2014, Helsinki, Finland. pp.S93P5. ⟨hal-01067621⟩

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