Silver sintering wire-bonding less power module for high temperature applications

Francois Le Henaff (1) , Stephane Azzopardi (1) , Loïc Théolier (1) , Jean-Yves Deletage (1) , Eric Woirgard (1) , Serge Bontemps (2) , Julien Joguet (3)

1 IMS - Laboratoire de l'intégration, du matériau au système
2 Microsemi Power Module Products
3 Alpha

Integrity of the power module is mainly provided by interconnections between the different components. Due to RoHS restrictions, conventional lead-based solders cannot be used anymore. New solutions of die-attach have been investigated such as transient liquid phase bonding or silver sintering which is currently the most advanced alternative technology. Furthermore, the increase of electrification in transportation system requires a high thermal management because power electronics systems can be located in severe thermal environment and have to dissipate high self-heating. Double-side cooling power modules do not use wires bonding anymore, highly responsible for many failures. To match such requirements, a new structure combining silver sintering and double side cooling system has been developed and characterized. A prototype of a wireless single-phase bridge rectifier has been investigated.

Domaines: Energie électrique

Francois Le Henaff, Stephane Azzopardi, Loïc Théolier, Jean-Yves Deletage, Eric Woirgard, et al.. Silver sintering wire-bonding less power module for high temperature applications. Symposium de Génie Électrique 2014, Jul 2014, Cachan, France. ⟨hal-01065293⟩