Low Temperature Irreversible Poly(DiMethyl) Siloxane Packaging of Silanized SU8 Microchannels: Characterization and Lab-on-Chip Application

Feriel Sihem Hamdi (1, 2) , M. Woytasik (2) , Magdalèna Couty (2) , Olivier Français (3) , Bruno Le Pioufle (3) , Elisabeth Dufour-Gergam (2)

1 SATIE - Systèmes et Applications des Technologies de l'Information et de l'Energie
2 IEF - Institut d'électronique fondamentale
3 SATIE-SIAME - Systèmes d'Information et d'Analyse Multi-Echelles

In this paper, we describe and characterize a novel method, based on silanization, for strong bonding of SU8 microchannels to poly(dimethyl)siloxane (PDMS) flexible covers. First, the SU8 surface treatment process (silanization) is characterized through atomic force microscopy and contact angle measurements. The aging study proves grafting stability during more than two days. Silanized SU8 patterns and PDMS cover are finally bonded to seal the microchannel network. Such assembled microdevices can be used without leakage at flow rates above 2.4 mL/min, corresponding to 1.2 MPa if the PDMS deformation is neglected. The bonding tensile pressure exceeds 1.5 MPa, proving the packaging strength. Furthermore, SU8-PDMS composite devices display stable bonding after several weeks of storage. This rapid low cost and low temperature bonding technique is finally successfully employed to fabricate a fully packaged biochip for electric and fluidic handling of biological cells.

Domaines: Sciences de l'ingénieur [physics]; Micro et nanotechnologies/Microélectronique

Feriel Sihem Hamdi, M. Woytasik, Magdalèna Couty, Olivier Français, Bruno Le Pioufle, et al.. Low Temperature Irreversible Poly(DiMethyl) Siloxane Packaging of Silanized SU8 Microchannels: Characterization and Lab-on-Chip Application. Journal of Microelectromechanical Systems, 2014, pp.ISSN 1057-7157. ⟨10.1109/JMEMS.2014.2331454⟩. ⟨hal-01063867⟩