US Patent 5,664,990, Integrated Process Equipment Corp, 1997. ,
, Thin Solid Films, pp.538-542, 1997.
, J. Mater. Sci. Mater. Electron, vol.12, pp.63-68, 2001.
, Microelectron. Eng, vol.77, pp.263-269, 2005.
Key chemical components in metal CMP slurries, Microelectronic Applications of Chemical Mechanical Planarization, pp.201-248, 2007. ,
, J. Colloid Interface Sci, vol.320, pp.219-237, 2008.
, Wear, vol.257, pp.863-868, 2004.
, Electrochim. Acta, vol.47, pp.2473-2482, 2002.
Chemical-Mechanical Planarization of Semiconductor Materials, Metal CMP science, pp.85-132, 2004. ,
Microelectronic Applications of Chemical mechanical Planarization, 2007. ,
, US Patent, vol.7, pp.58-60, 2006.
International Patent PCT/US1997/ 022083, Cabot Corporation, 1997. ,
US Patent 5,783,489, Cabot Corporation, 1998. ,
US Patent 6,316,366, Cabot Microelectronics Corporation, 2001. ,
, Microelectron. Eng, vol.84, pp.80-86, 2007.
, , p.191, 2000.
, Wear, vol.259, pp.1367-1371, 2005.
, J. Electrochem. Soc, vol.152, p.299, 2005.
, Micron, vol.20, p.85, 2002.
, 204th Meeting of The Electrochemical Society, pp.139-148, 2003.
US Patent 6, vol.866, 2005. ,
, J. Hazard. Mater, vol.116, pp.75-81, 2004.
, J. Hazard. Mater, vol.192, pp.440-450, 2011.
, Wear, vol.214, pp.10-13, 1998.
, Wear, vol.211, pp.271-279, 1997.
, Appl. Surf. Sci, vol.257, pp.6163-6170, 2011.
Microelectronic Applications of Chemical mechanical Planarization, Tungsten CMP applications, pp.277-294, 2007. ,
Développement d'un procédé innovant de retraitement des slurries de l'industrie microélectronique, 2011. ,
, First International Symposium on Chemical Mechanical Planarization, pp.59-69, 1997.
Pad-wafer and brush-wafer contact characterization in planarization and post-planarization processes, thesis, 2009. ,
, Chem. Rev, vol.110, pp.178-204, 2010.
, J. Electrochem. Soc, vol.153, pp.169-172, 2006.
, J. Neurosci. Methods, vol.198, pp.158-171, 2011.
, J. Electrochem. Soc, vol.145, pp.2718-2725, 1998.
Chemical Mechanical Planarization of Microelectronic Materials, 1997. ,
Oxidation and dissolution characteristics of tungsten: application to chemical mechanical polishing, Electrochemical Processing in ULSI Fabricatrion III: Proceedings of the International Symposium, pp.234-243, 2002. ,
, , vol.27, pp.743-751, 2002.
, Mater. Lett, vol.60, pp.1192-1197, 2006.
, Wear, vol.255, pp.869-874, 2003.
, J. Electrochem. Soc, vol.138, pp.3460-3465, 1991.
, J. Electrochem. Soc, vol.148, pp.359-363, 2001.
, , pp.647-654, 1999.
, J. Colloid Interface Sci, vol.263, pp.506-515, 2003.
, J. Dispersion Sci. Technol, vol.21, pp.491-509, 2000.
, J. Mater. Res, vol.20, pp.3413-3424, 2005.
, Microelectron. Eng, vol.71, pp.90-97, 2004.
, Appl. Surf. Sci, vol.254, pp.1517-1523, 2007.
, Mater. Sci. Eng. R. Rep, vol.45, pp.89-220, 2004.
, Wear, vol.259, pp.1299-1307, 2005.
, Thin Solid Films, vol.498, pp.60-63, 2006.
, J. Electrochem. Soc, vol.153, pp.622-625, 2006.