Filling of very deep, wide trenches by BenzoCycloButene polymer

Hicham Mahfoz-Kotb (1) , Karine Isoird (1) , Frédéric Morancho (1) , Loïc Théolier (1) , Thierry Do Conto (2)

1 LAAS-ISGE - Équipe Intégration de Systèmes de Gestion de l'Énergie
2 LAAS - Laboratoire d'analyse et d'architecture des systèmes

A process for deep trench filling by BenzoCycloButene (BCB) polymer is explored. Deep trenches with 100-μm depth and different aspect ratios from 1.4 to 20 have been successfully filled by BCB. Besides, chemical mechanical polishing (CMP) of BCB is studied with the main goals of smoothing surface topography of substrate after BCB filling and removing excess BCB coating which may be necessary in some applications. Removal rate for BCB, V RR, of about 0.24 μm/min has been achieved for hard cured BCB films using acid slurry. After CMP, the BCB layer showed a roughness of about 1.36 nm (Rq, measured by atomic force microscopy, AFM).

Domaines: Energie électrique

Hicham Mahfoz-Kotb, Karine Isoird, Frédéric Morancho, Loïc Théolier, Thierry Do Conto. Filling of very deep, wide trenches by BenzoCycloButene polymer. Microsystem Technologies, 2009, 15 (9), pp.1395-1400. ⟨10.1007/s00542-009-0894-2⟩. ⟨hal-00991599⟩