Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy

Wissam Sabbah (1) , Stephane Azzopardi (1) , Cyril Buttay (2) , Régis Meuret (3) , Eric Woirgard (1)

1 IMS - Laboratoire de l'intégration, du matériau au système
2 AMPERE - Ampère
3 SAFRAN, Grp Hispano Suiza

Silver sintering joints and AuGe soldering are promising technologies for high temperature (>200 °C ambient) power electronics packaging. This paper presents the implementation of two silver-sintering processes with the one hand micrometer-scale silver particles, and on the other hand nano-meter-scale particles. Two substrates technologies have been investigated: A12O3 DBC and Si3N4 AMB. After the process optimization, tests vehicles have been assembled using both sintering processes, as well as a more classical high-temperature die attach technology: AuGe soldering. Multiple analyses have been performed, such as thermal resistance measurement, shear tests and micro-sections to follow the evolution of the joint during thermal cycling and high-temperature storage ageing.

Domaines: Energie électrique

Wissam Sabbah, Stephane Azzopardi, Cyril Buttay, Régis Meuret, Eric Woirgard. Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy. Microelectronics Reliability, 2013, 53 (9-11), pp.1617-1621. ⟨10.1016/j.microrel.2013.07.101⟩. ⟨hal-00881584⟩