Z. Zhang and L. Guo-quan, Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow, IEEE Transactions on Electronics Packaging Manufacturing, vol.25, issue.4, p.279, 2002.
DOI : 10.1109/TEPM.2002.807719

E. Ide, S. Angata, A. Hirose, and K. F. Kobayashi, Metal?metal bonding process using Ag metallo-organic nanoparticles, Acta Materialia, vol.53, issue.8, p.2385, 2005.
DOI : 10.1016/j.actamat.2005.01.047

W. O. Akande, Y. Cao, N. Yao, and W. Soboyejo, Adhesion and the cold welding of gold-silver thin films, Journal of Applied Physics, vol.107, issue.4, p.43519, 2010.
DOI : 10.1063/1.3305791

J. G. Bai, Z. Z. Zhang, J. N. Catala, and L. Guo-quan, Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material, IEEE Transactions on Components and Packaging Technologies, vol.29, issue.3, p.589, 2006.
DOI : 10.1109/TCAPT.2005.853167

N. Ballarini, F. Cavani, and E. D. Esposito, Low-organics method to synthesize silver nanoparticles in an aqueous medium, Z. Sobalik, J. Dedecek, Stud. Surf. Sci. Catal, vol.175, pp.823-826, 2010.
DOI : 10.1016/S0167-2991(10)75169-7

W. Schmitt, Electronic System and Integration Technology Conference, p.1, 2010.

R. R. Tummala and E. J. Rymaszewski, Microelectronics Packaging Handbook, p.37, 1989.