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Journal articles
Silver oxalate-based solders: New materials for high thermal conductivity microjoining
Abstract : Micrometric oxalate powders can be decomposed starting from temperatures as low as 90°C, leading to the formation of temporary nanometric grains of metallic silver with a high propensity for sintering. The decomposition being highly exothermic, this additional energy favours the sintering, i.e. the soldering, process. Solders processed at 300°C and very low pressure (<0.5 MPa) displayed a thermal conductivity close to 100 W m-1 K-1, making silver oxalate very promising for safe, moderate temperature and very low pressure bonding.
Cited literature [7 references]
https://hal.archives-ouvertes.fr/hal-00832138
Contributor : Open Archive Toulouse Archive Ouverte (oatao) <>
Submitted on : Monday, June 10, 2013 - 11:15:17 AM
Last modification on : Friday, January 10, 2020 - 9:08:21 PM
Long-term archiving on: : Wednesday, September 11, 2013 - 4:11:38 AM
Contributor : Open Archive Toulouse Archive Ouverte (oatao) <>
Submitted on : Monday, June 10, 2013 - 11:15:17 AM
Last modification on : Friday, January 10, 2020 - 9:08:21 PM
Long-term archiving on: : Wednesday, September 11, 2013 - 4:11:38 AM
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kiryukhina_8792.pdf
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