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Silver oxalate-based solders: New materials for high thermal conductivity microjoining

Abstract : Micrometric oxalate powders can be decomposed starting from temperatures as low as 90°C, leading to the formation of temporary nanometric grains of metallic silver with a high propensity for sintering. The decomposition being highly exothermic, this additional energy favours the sintering, i.e. the soldering, process. Solders processed at 300°C and very low pressure (<0.5 MPa) displayed a thermal conductivity close to 100 W m-1 K-1, making silver oxalate very promising for safe, moderate temperature and very low pressure bonding.
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https://hal.archives-ouvertes.fr/hal-00832138
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Kateryna Kiryukhina, Hoa Le Trong, Philippe Tailhades, Jacques Lacaze, Valérie Baco-Carles, et al.. Silver oxalate-based solders: New materials for high thermal conductivity microjoining. Scripta Materialia, Elsevier, 2013, vol. 68, pp.623-626. ⟨10.1016/j.scriptamat.2012.12.018⟩. ⟨hal-00832138⟩

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