Damage free cryogenic etching of porous organosilicate low-k films for advanced interconnect application

Liping Zhang (1) , Rami Ljazouli , Philippe Lefaucheux (2) , Thomas Tillocher (2) , Remi Dussart (2) , Yuri Mankelevich (1) , Jean-Francois de Marneffe (1) , Stefan de Gendt (1) , Mikhail Baklanov (1)

1 IMEC - IMEC
2 GREMI - Groupe de recherches sur l'énergétique des milieux ionisés

Domaines: Physique des plasmas [physics.plasm-ph]

Liping Zhang, Rami Ljazouli, Philippe Lefaucheux, Thomas Tillocher, Remi Dussart, et al.. Damage free cryogenic etching of porous organosilicate low-k films for advanced interconnect application. AVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States. ⟨hal-00747749⟩